10 Things That Electronic Product Designers Should Look For

In the ever-evolving world of Printed Circuit Board (PCB) manufacturing, selecting appropriate component packages is pivotal in the design and production. This choice becomes particularly crucial for startups and small companies who might not have access to sophisticated laboratories and equipment. Larger component packages, for instance, can be more manageable for in-house adjustments and reworks, streamlining the initial design stages.

As companies progress from the Proof of Concept (POC) stages to mass production, understanding the implications of different packaging types becomes essential. This knowledge should be reflected in the Bill of Materials (BOM), guiding Electronic Manufacturing Services (EMS) partners in selecting the most efficient packaging for high-volume manufacturing. For example, reel-type packages enhance the speed of SMT machines in component placement, whereas tray and tube packages can slow down the placement process.

Different applications, such as power, defense, or aerospace, impose specific requirements on component packaging. In demanding environments, such as space applications, components like Ball Grid Arrays (BGAs) and smaller footprints are often avoided due to concerns like vibration failures. Thus, understanding and adhering to these environmental and application-specific considerations is critical in designing reliable and robust electronics.

Even today, many designers rush into production without adhering to standards or processes, leading to numerous issues post-manufacturing. The importance of standardising schematic symbols and PCB footprints cannot be overstated. Adherence to standards such as IPC 7351 ensures that components are correctly placed on the grid, preventing connection issues and enhancing the design’s manufacturability. The design of SMT components must follow specific guidelines, significantly when scaling production from prototypes to larger volumes. A common misunderstanding between designers and manufacturers often arises due to design scalability and manufacturability discrepancies. Utilising footprint standards ensures that as production scales, the design remains feasible for manufacturing, avoiding potential conflicts and quality issues.

Incorporating 3D models of components in PCB design is increasingly important, especially in designs with tight enclosures or specific spatial requirements. These models allow for preemptive adjustments in component selection and placement, addressing potential issues before finalising the PCB design and proceeding with mechanical CAD outputs.

Effective placement of components on a PCB is crucial for optimal functionality and reliability. Designers must plan the placement considering inputs and outputs, mechanical stability, connector types, and signal integrity. Segregating different functional blocks (e.g., power supply, signal processing, Analog and RF sections) and considering thermal management in the placement strategy are key factors in achieving a successful PCB design.

Thermal management is critical to PCB design, particularly for components that generate significant heat. Ensuring adequate natural airflow, using appropriate heat dissipation techniques, and avoiding clustering significant components near heat-generating areas are essential practices. These considerations not only impact the performance of the PCB but also influence the efficiency of SMT operations during manufacturing.

For startups and emerging companies in the electronics sector, understanding and implementing adequate component packaging and placement strategies are vital steps towards efficient and reliable manufacturing. Adhering to industry standards, considering application-specific requirements, and planning for scalability and thermal management are key components of a successful electronics manufacturing process. As companies grow and evolve, these practices will lay a strong foundation for product development, ensuring that their designs are innovative and manufacturable at scale.

Transitioning from a successful prototype to mass production is a complex yet critical step for any electronics manufacturer. This journey involves not only proving the concept and functionality of a product but also scaling up production efficiently and cost-effectively. There are several key factors manufacturers must consider to navigate this transition smoothly. They are mentioned as follows:

Embracing the Design for Excellence (DfX) Approach

DfX, encompassing Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT), is crucial in scaling production. DFM ensures that PCB designs comply with manufacturing capabilities, including footprint accuracy, trace width spacing, and drill sizes. DFA considers assembly aspects, like thermal dissipation and component placement, to prevent soldering issues during reflow. DFT involves planning for efficient testing strategies, whether manual or automated, to guarantee product reliability at scale.

Component Selection and Lead Time Management

Selecting the right components at the outset is vital. This process includes considering lead times and ensuring component availability during scale-up. Avoid reliance on open-source codes that might not be compatible with the design and ensure that the code aligns with the hardware.

Importance of Having Alternate Sources

The semiconductor shortage in 2020 highlighted the need for alternate sources and combined footprints in component selection. This foresight allows for flexibility in production and timely market delivery, especially for critical components like microcontrollers, memory, and microprocessors.

Developing an Effective Test Strategy for PCB and Systems

A robust test strategy, particularly for systems comprising multiple PCBs, is essential. This strategy should encompass individual PCB and system integration testing, considering aspects like mechanical connectors and ensuring open I/Os for future functionality testing.

Adhering to Global Standards

Understanding and complying with global standards is paramount. This compliance varies across industries, such as automotive or aerospace, where specific component standards must be met to ensure product reliability and market acceptance.

Selecting the Right Manufacturing Partner

Choosing an appropriate Electronic Manufacturing Service (EMS) partner is critical. Manufacturers must align with partners capable of handling their specific requirements, whether dealing with unique materials like Rogers for RF applications or managing different temperature profiles during assembly.

Component Engineering and Obsolescence Management

Effective component engineering involves continuous cost reduction efforts and exploring alternate part numbers. Obsolescence management is another critical aspect, ensuring that components remain available throughout the product’s lifecycle.

Homologation for International Markets

Adapting products for different markets is vital. This adaptation accommodates various electrical standards, such as voltage differences between the US and European regions. Homologation ensures that products meet specific country or regional standards for market entry.

Scaling from a Proof of Concept (POC) to mass production in electronics manufacturing is an art that involves meticulous planning, detailed process adherence, and strategic decision-making. Each stage, from component selection to final assembly and testing, plays a pivotal role in ensuring the successful transition of a product from prototype to high-volume production. By following these guidelines, manufacturers can navigate the complexities of this journey, ensuring product reliability, cost-effectiveness, and market competitiveness. This comprehensive approach enhances the product’s lifecycle and solidifies the manufacturer’s reputation in the dynamic world of electronics.

This article is from a tech talk session at Delhi EXPO 2023, Delhi, by Prabu Murugan, Co-Founder & Director. ZettaOne Technologies. Transcribed and curated by Akanksha Sondhi Gaur, Senior Technical Journalist at EFY.