3D AXI Platform With Clearer Imaging

What if your inspections could be faster, more precise, and never stop production? Discover how a new 3D AXI system is changing the process.

Test Research, Inc. (TRI), a provider of Test and Inspection solutions for the electronics manufacturing industry have launched the 3D AXI TR7600FB SII system, offering more precise imaging.

Quality control engineers can use the system to inspect electronic components and assemblies. Manufacturing engineers can utilize it to test and monitor production processes. Test engineers can perform inspections to detect defects in electronic components. Production managers can manage inspection processes on the production line. R&D teams can assess the performance of designs and prototypes during development. Maintenance technicians can troubleshoot and ensure systems are working during production. Operations managers can oversee and optimize integration of testing and inspection systems within factories or automated production environments.

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This X-ray imaging design addresses product layouts and is optimized for substrates, BGAs, multilayered structures, SiP, IC, CSP, and Flip-Chip components. The SII system is suitable for inspecting components at the top with high resolution, ensuring clear imaging by positioning the tube very close to the bottom side without interference.

The X-ray inspection platform can handle boards up to 850 mm x 520 mm and weigh up to 12kg. The TR7600FB SII delivers 5 to 30 µm inspection resolutions, detecting defects for industries like Aerospace, Advanced Packaging, Automotive, Data Center, IIOT, Medical, and Mobile Devices.

The Smart 3D AXI focuses on usability with AI integration to streamline inspection processes. The interface and AI-assisted programming allow operators to set up and manage inspections quickly. The SII system also supports Inline fine-tuning for multiple samples without halting production.

A few key features of the 3D AXI include:

• AI inspection algorithms, AI-void detection, and programming
• 5 µm high precision for defect detection
• Next-gen mechanical design for speed up to 20 FOV/s
• Large board inspection (850 mm x 520 mm, up to 12 kg)
• Smart factory ready with MES connectivity
• Communication standards: SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852

The 3D AXI integrates with Smart Factory production lines and MES systems, supporting standards like IPC-CFX, IPC-DPMX, and IPC-HERMES-9852 to future-proof production processes.