3nm Interconnected Platform For Most Demanding AI Workloads

Marvell’s Ara platform sets a new standard for AI-driven infrastructure with the first 3nm, 1.6Tbps PAM4 interconnect platform.

Marvell Technology, California has introduced its Ara platform, the world’s first 3nm, 1.6Tbps PAM4 (pulse amplitude modulation with 4 levels) interconnect solution to meet the rising demand for AI bandwidth. The platform offers great power efficiency and speed, supporting high-speed data transmission for upcoming AI workloads. This innovation aims to address the growing need for higher bandwidth and performance in data centres while maintaining operational cost efficiency.

Developed from the success of its previous 5nm Nova 2 DSP, the new platform features unique 3nm technology. The platform integrates eight 200Gbps electrical lanes and eight optical lanes, enabling an impressive 1.6Tbps transfer rate. As a result, it significantly reduces the power consumption of optical modules by over 20%, making it more energy-efficient and cost-effective for large-scale AI and cloud infrastructure. Ideal for hyperscale data centres, cloud providers, network operators, and AI-focused enterprises, it will support businesses aiming to enhance their AI infrastructure with scalable, high-performance solutions.

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“Ara sets a new industry standard by using advanced 3nm technology to deliver significant power reduction, driving the volume adoption of 1.6Tbps connectivity for AI infrastructure,” said Xi Wang, vice president, product marketing for optical connectivity, Marvell. This reduction in energy usage positions the new platform as an ideal solution for scaling AI applications and large-scale computing.

The platform also integrates a companion TIA, increasing performance and energy efficiency for demanding AI workloads. Osa Mok, chief marketing officer, InnoLight technology emphasised the power efficiency of the solution, “Ara is another Marvell optical connectivity industry-first solution, delivering the power efficiency required for the most demanding AI workloads.”

In the coming years, unit shipments of PAM4 digital signal processors (DSP) are expected to triple, with this platform positioned to play a pivotal role in this growth. It is optimised to support 200Gbps I/O interfaces across switches, network interface cards, and XPUs. Backward compatibility ensures it can serve a wide range of infrastructure needs.