Printed Circuit Board Design Engineer At Bajaj Auto Technology Limited In Pune

Location: Pune

Company: Bajaj Auto Technology Limited

Job Role & Responsibilities

Role: Power Electronics Engineer

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Technical/Functional

PCB Layout Design for Power Electronics:

• Design multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, and battery management systems (BMS).
• Optimize power planes, creepage & clearance distances, and thermal dissipation for high-voltage (>96V) and high-current applications.
• Ensure low-inductance routing, controlled impedance, and effective grounding strategies for high-power circuits.
• Select appropriate PCB materials (FR4, Rogers, Polyimide, etc.) for high-reliability applications.
• Implement EMI/EMC best practices, including shielding, filtering, and differential pair routing.

PCB Layout for RF & High-Speed Designs:

• Design PCBs for RF modules, antennas, and high-speed signal transmission (GHz range).
• Implement microstrip, stripline, coplanar waveguides, and controlled impedance routing.
• Optimize layouts for minimum crosstalk, reflection, and insertion loss.
• Work closely with RF engineers for layout optimization, grounding, and signal integrity enhancements.
• Conduct EMI simulations and compliance testing to meet RF regulatory standards.

PCB Layout for Analog & Mixed-Signal Circuits:

• Design low-noise, precision analog circuit layouts, including op-amps, ADCs, DACs, and sensor interfaces.
• Implement star-grounding, guard rings, and Kelvin sensing techniques for ultra-low- noise performance.
• Optimize high-precision data acquisition and mixed-signal PCB layouts.
• Ensure minimized parasitic capacitance and inductance in sensitive analog circuits.

Thermal & Mechanical Considerations:

• Design thermal vias, heat sinks, copper pours, and metal core PCBs (MCPCB) for high-power applications.
• Work closely with mechanical engineers to optimize PCB integration within enclosures and cooling solutions.
• Work closely with CFTs to perform thermal simulations and power dissipation analysis for PCB heat management.

Design Validation & Compliance:

• Perform DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Testability) analysis.
• Collaborate with fabrication and assembly vendors to ensure high-yield production.
• Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and automotive/industrial safety norms.

Specific Expertise Required For Functional Domain

• PCB layout tools: Altium Designer, Cadence Allegro, Mentor Xpedition, KiCad, Eagle, or OrCAD.
• Power electronics PCB design: High-voltage (>96V), high-current layouts, creepage/clearance design.
• RF PCB layout: Controlled impedance, high-frequency design, shielding, and SI/PI analysis.
• Analog circuit PCB layout: Low-noise routing, precision signal integrity, and EMI/EMC mitigation.
• DFM/DFA considerations: PCB stack-up design, material selection, thermal & mechanical integration.
• Simulation tools: Ansys SIwave, HyperLynx, LTspice, CST Studio, Keysight ADS for RF/mixed-signal analysis.
• Knowledge of PCB fabrication & assembly: HDI, flex-PCB, rigid-flex, metal core PCBs (MCPCB).

Behavioral

• Demonstrates excellent communication skills, both written and verbal.
• Serves as an effective team player with the capability to lead and mentor a group of engineers.
• Anticipates challenges, takes proactive actions, and fosters a culture of continuous improvement.
• Creates and maintains comprehensive technical documentation, including design calculations.
• Encourages innovation in technology and cost optimization, promoting intellectual property (IP) generation within the team.
• Possesses the ability to transform concepts into practical, real-world solutions.
• Communicates effectively with team members, peers, suppliers, and senior leadership.
• Collaborates seamlessly with cross-functional teams to develop innovative and impactful solutions.