Save Energy With New Power Modules

The next generation of power modules is here—built to reduce energy use, lower costs, and cut emissions across fans, drives, and industrial systems.

Onsemi has introduced its first generation of 1200V silicon carbide (SiC) MOSFET-based SPM 31 intelligent power modules (IPMs). These new EliteSiC IPMs deliver higher energy efficiency and power density in a smaller footprint compared to Field Stop 7 IGBT technology. This leads to lower overall system costs. With improved thermal performance, reduced power losses, and support for fast switching, they are well suited for three-phase inverter drive applications—including EC fans in AI data centers, heat pumps, HVAC systems, servo motors, robotics, variable frequency drives (VFDs), and industrial pumps and fans.

As data centers expand, demand for EC fans—which are critical for maintaining proper temperatures and ensuring stable data transmission—will continue to rise. Like many industrial systems—including compressor drives and pumps—EC fans need more power density and efficiency than traditional, bulkier IGBT solutions. By switching to IPMs, customers gain a smaller design footprint, better performance, and easier system integration. This reduces development time, lowers overall system cost, and cuts greenhouse gas emissions. For instance, replacing a system using a standard IGBT-based power module with 500W of power loss at 70% load with an IPM could cut annual energy use and cost per EC fan by up to 52%.

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The EliteSiC SPM 31 IPMs include the following benefits:

• Low-loss M3 SiC MOSFETs prevent shock or fire.
• Built-in low voltage (UVP) protection.
• The same PCB works for different current options.
• UL certified for safety.
• One-ground power supply for safety and less noise.

The fully integratedIPM includes an independent high-side gate driver, a low-voltage IC (LVIC), six EliteSiC MOSFETs, and a temperature sensor (either a voltage temperature sensor or a thermistor). It uses M3 SiC technology, which enables a smaller die size and is optimized for hard-switching applications. This technology also improves short-circuit withstand time (SCWT), making the module ideal for industrial inverter motor drives. The MOSFETs are arranged in a three-phase bridge with separate lower-leg source connections, offering flexibility in control algorithm design.