Small And Smart Power Control Chip

The chip saves space, cuts energy loss, removes the need for heat sinks, supports modern devices, reduces parts, and helps meet energy rules.

Infineon Technologies AG has introduced its new CoolSET System-in-Package (SiP) — a compact, fully integrated power controller designed to deliver up to 60 W of highly efficient power across a universal input voltage range of 85–305 V AC. Housed in a compact SMD package, the integrated high-voltage MOSFET eliminates the need for an external heat sink, thereby reducing both system size and design complexity.

The CoolSET SiP supports zero-voltage switching (ZVS) flyback operation, which minimizes switching losses and electromagnetic interference (EMI), while improving reliability and robustness. This makes it particularly well-suited for applications such as major home appliances and AI servers. It also helps designers meet stringent energy efficiency standards, making it a future-ready solution for modern power designs.

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Key components integrated into the CoolSET SiP include a 950 V startup cell, an 800 V avalanche-rugged CoolMOS P7 superjunction (SJ) MOSFET, a ZVS primary-side flyback controller, a secondary-side synchronous rectification (SR) controller, and reinforced isolated communication using Infineon’s proprietary CT Link technology.

Some of the key features of the CoolSET SiP include:

• Works with power levels up to 60 W from a wide voltage range
• Comes in a small package that saves space and parts
• No need for an extra heat sink
• Uses special switching to waste less energy and reduce noise
• Includes strong safety features to protect the system
• Has built-in parts that usually need to be added separately
• Helps meet modern energy-saving rules
• Makes design easier and reduces the number of parts needed
• Good for things like home appliances and AI computers

This high level of integration enables the creation of more advanced products by significantly reducing the number of discrete components, shrinking the bill of materials (BOM), and saving PCB space. Additionally, a rich set of advanced protection features simplifies system integration and gives designers more flexibility to optimize performance and enhance user experience.