
Check out our latest products
Set to revolutionize 5G Fixed Wireless Access and AI-enabled networks with features like 3GPP Release 18 support, 10Gbps speeds, and advanced Edge AI integration for smarter, faster connectivity solutions.

MediaTek has announced its latest innovation, the T930 chipset, designed to power next-generation 5G Fixed Wireless Access (FWA) and mobile Wi-Fi (Mi-Fi) devices. Built on a 4nm process, the highly integrated and power-efficient T930 supports sub-6GHz 5G connectivity and delivers speeds of up to 10Gbps—setting a new benchmark for high-performance broadband access.
The key features are:

- Supports latest 3GPP Release 18 standard
- First to feature 6CC carrier aggregation
- Enables 5-layer uplink with 3Tx for faster uploads
- Offers 8Rx with 200MHz downlink bandwidth
- Achieves uplink speeds up to 2.8Gbps
- Enhances cell-edge performance by up to 40%
- Improves signal coverage and spectrum efficiency
At its core, it integrates the company’s new M90 5G modem, a quad-core Arm Cortex-A55 CPU, and a dedicated network processor to deliver full-rate 5G-to-Wi-Fi/Ethernet throughput. The chipset also includes an RF transceiver, GNSS receiver, and power management unit for comprehensive platform support.
A standout feature is its ability to be paired with a dedicated NPU chip to create Generative AI-enabled gateway devices. These next-gen AI gateways will bring advanced Edge AI processing directly to the network, enabling smart, low-latency interactions with connected devices. MediaTek’s progress in Edge AI has been spotlighted in recent industry events, and the company continues to collaborate with leading partners to accelerate ecosystem development.
“The rapid growth of 5G services and AI-enabled applications is driving demand for smarter, faster connectivity solutions,” said JC Hsu, Corporate SVP at MediaTek. “The T930 sets a powerful foundation for new device categories that combine ultra-fast 5G with intelligent Edge AI capabilities.”