High Current Board-To-Board Connectors

The board-to-board connectors have a 0.4 mm pitch and 0.7 mm stacking height, providing strong connections and high current support for small devices.

JAE has introduced the WP11 and WP12 Series, compact board-to-board connectors with a 0.4 mm pitch and a 0.7 mm mated stacking height. Designed for ICT devices like small terminals, smartphones, wearables, and gaming PCs, these connectors support up to 15 A of power supply.

As smartphones, wearable terminals, and tablets become smaller and thinner, internal connectors must be more compact while maintaining durability to prevent damage during assembly. High-current connectors are also needed to support faster charging for large-capacity batteries.

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To meet these demands, JAE has introduced the WP11 Series, which maintains the pitch and mated height of the WP10 Series but delivers 1.25 times the current at 15 A with enhanced robustness. The WP12 Series builds on these improvements with a more compact design and higher connector retention force.

The WP11 Series features a seamless guide structure for the plug hold-down, achieved through a drawing process. This design ensures smooth mating and reduces the risk of damage, enhancing durability while maintaining a compact size.

Some of the key features of the WP11 and WP12 Series include:

• Power terminal and hold-down support 15A supply
• 0.4mm pitch, 0.7mm stacking height
• Improved workability for customers with a clear click feeling
• Highly reliable 2-point of contact
• Nickel barrier on contacts prevents solder wicking
• Inviting shape with seamless drawing process, high robustness (WP11)
• Compact design with a length of 5 mm and a width of 2.23 mm (WP12)
• High extraction force achieved with additional detent feature in hold-down (WP12)

By reducing the size of the hold down, the WP12 Series is smaller than the WP11 Series, measuring 5 mm in length and 2.23 mm in width. The built-in dowel structure enhances connector retention, exceeding 10 N, which helps prevent disconnection during assembly or under high shock and vibration.