High Power Density SiC Power Modules

The SiC modules combine key power circuits in one package, cutting heat, saving space, and boosting performance in electric vehicle and industrial power systems.

ROHM has introduced new 4-in-1 and 6-in-1 SiC molded modules in the compact HSDIP20 package, designed for PFC and LLC converters used in onboard chargers (OBC) for electric vehicles (xEVs). The range includes six 750V models and seven 1200V models. These modules combine all essential power conversion circuits into a single compact package, helping manufacturers reduce design complexity and shrink the size of power conversion systems in OBCs and other high-power applications. In industrial settings, it supports applications like EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, and power conditioners.

As EVs move toward higher battery voltages to boost driving range and charging speed, there’s a growing demand for more powerful OBCs and DC-DC converters. At the same time, the market is pushing for smaller, lighter systems. Meeting these demands requires advances in power density and thermal performance. ROHM’s HSDIP20 package tackles these challenges by offering an integrated solution that improves both output and heat dissipation—overcoming limitations of traditional discrete setups and supporting the downsizing of electric powertrains.

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The HSDIP20 package uses an insulating substrate with strong heat dissipation capabilities, keeping chip temperatures low even during high-power operation. In a comparison between a typical OBC PFC circuit using six discrete SiC MOSFETs with top-side cooling and ROHM’s 6-in-1 module under the same conditions, the HSDIP20 ran approximately 38°C cooler at 25W operation.

This efficient thermal performance allows the compact module to handle high currents, delivering industry-leading power density—over three times that of top-side cooled discrete solutions and more than 1.4 times that of similar DIP-type modules. As a result, the HSDIP20 can reduce the mounting area of a PFC circuit by about 52% compared to top-side cooled discrete setups, helping significantly reduce the size of power conversion circuits in applications like onboard chargers.