Industry’s First PCIe Wi-Fi 7 + Bluetooth Module

Tired of slow Wi-Fi? A new module with Wi-Fi 7 and Bluetooth 5.3 is here. Faster speeds, lower delay, and easy setup. Read on…

Silex Technology America, Inc. has introduced the SX-PCEBE, the first embedded radio module to support Wi-Fi 7 (802.11be) and Bluetooth 5.3. Qualcomm’s QCC2076 System-On-Chip (SoC) empowers Dual-Band Simultaneous (DBS) operation across 2.4GHz, 5GHz, and 6GHz for reliable high-performance connectivity.

Designed for AI-driven devices, the SX-PCEBE integrates Silex’s optimized drivers for medical and industrial applications, ensuring seamless Wi-Fi 7 connectivity on platforms from NVIDIA, Qualcomm, and NXP. Silex provides enhanced software drivers, enterprise-grade connectivity, and streamlined product development support through key partnerships.

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With rising demand for data-intensive applications, Wi-Fi 7 unlocks new possibilities in AI-powered cameras, remote monitoring, augmented reality, and ultra-high-definition video streaming. The broader 6 GHz spectrum, multi-link operation (MLO), and faster transmission rates deliver twice the throughput of Wi-Fi 6, improved reliability, and reduced latency, according to the Wi-Fi Alliance.

A few key features of the  SX-PCEBE include:

• Available in M.2 LGA 1620 and M.2 PCIe card form factors
• Easy upgrade from legacy PCIe radios to Wi-Fi 7
• Works on any M.2-equipped platform
• Supports 2.4GHz, 5GHz, and 6GHz bands
• Dual-band simultaneous operation
• Plug-and-play Linux drivers for NXP i.MX and NVIDIA Jetson
• Operates in -40°C to 85°C industrial conditions

“Silex is thrilled to be the first to bring this technology to the market and enable medical and industrial enterprises to harness the power of Wi-Fi 7,” says Keith Sugawara, CEO of Silex Technology. “The SX-PCEBE and Wi-Fi 7 is a major leap forward in Wi-Fi performance, delivering faster, more secure connectivity without additional driver development for leading AI computing platforms. Customers will be able to future-proof their product innovations and get to market faster.”

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