MCU For Space-Constrained Applications

Its compact design and scalable portfolio offer engineers flexibility to develop efficient embedded solutions.

Texas Instruments (TI) has announced a new addition to its Arm Cortex-M0+ MSPM0 microcontroller (MCU) portfolio. The MSPM0C1104 MCU is now available in a wafer chip-scale package (WCSP) measuring 1.38mm², designed for applications where board space is a priority, such as medical wearables and personal electronics.

Adding this device to the MSPM0 portfolio expands the range of options available to engineers developing space-efficient designs. This MCU portfolio includes more than 100 cost-effective devices, each offering different configurations of analog peripherals and computing capabilities. These MCUs are intended to enhance sensing and control functions in embedded applications. 

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The key features include:

• Extended Temperature Range: –40°C to 125°C
• Supply Voltage: 1.62V to 3.6V
• Processor: Arm® 32-bit Cortex®-M0+, up to 24MHz
• Memory: Up to 16KB flash, 1KB SRAM
• Analog Peripherals: One ADC with up to 10 external channels, 1.7Msps (10-bit) or 1.5Msps (12-bit) sampling rate with VDD as voltage reference, configurable internal ADC voltage reference (1.4V or 2.5V), integrated temperature sensor, and supply monitor.

The MCU integrates WCSP technology with selected features designed to optimize space and cost. The eight-ball WCSP measures 1.38mm², which is 38% smaller than comparable devices. The MCU includes 16KB of memory, a 12-bit analog-to-digital converter with three channels, six general-purpose input/output pins, and compatibility with communication interfaces including Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI), and Inter-Integrated Circuit (I²C). This integration allows engineers to maintain computing performance without increasing board size.

Itis part of the company’s broader MSPM0 portfolio, which supports scalability and cost efficiency for a range of applications in personal electronics, industrial, and automotive markets. The portfolio includes pin-to-pin compatible package options, enabling engineers to match memory, analog, and processing needs without redesigning hardware. Pricing starts at $0.16 in 1,000-unit quantities, with additional small-package options available to further reduce board size and component costs.

The company’s development ecosystem includes a software development kit, a hardware prototyping kit, reference designs, and subsystems. The Zero Code Studio tool allows users to configure and test applications without coding. Vinay Agarwal, vice president and general manager of MSP Microcontrollers at TI, highlighted the role of compact components in modern embedded systems, particularly in applications like earbuds and medical probes.

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