Small, Fast, And Powerful Car Module

The car chip improves driver assistance and displays. It makes cars work better and helps automakers design them more easily.

LG Innotek announced the launch of its Automotive Application Processor Module (AP Module), targeting the global automotive semiconductor market. This marks the company’s expansion into automotive semiconductor components.

The Automotive AP Module integrates and controls vehicle electronic systems, including Advanced Driver Assistance Systems (ADAS) and digital cockpits, functioning like a car’s central processor. With the rise of connected and autonomous vehicles, demand for AP modules is growing rapidly, as traditional PCB-based chips struggle to handle the increasing data loads from high-resolution displays and advanced ADAS features.

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A key advantage of LG Innotek’s AP Module is its compact design. Measuring just 2.5 inches x 2.5 inches, it houses over 400 components, including a memory semiconductor, Power Management Integrated Circuit (PMIC), and a System on Chip (SoC) for data and graphics processing, display output, and multimedia functions. This miniaturization reduces motherboard size, improves design flexibility for automakers, and enhances control performance by shortening signal distances between integrated components.

LG Innotek plans to enhance the module’s heat dissipation, enabling operation at up to 95°C, and accelerate development using virtual simulations to predict warpage. The company is currently promoting the module to global semiconductor firms, with mass production expected in the second half of the year.

CEO Moon Hyuksoo commented, “The development of Automotive AP modules has enabled us to accelerate the expansion of our semiconductor components business.” He added, “LG Innotek will continue to develop products that deliver unique customer value and establish itself as a reliable technology partner for its global customers.”

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